1 motorola sensor device data ! the mpx53 silicon piezoresistive pressure sensor provides a very accurate and linear voltage output e directly proportional to the applied pressure. this standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. compensation techniques are simplified because of the predictability of motorola's single element strain gauge design. features ? low cost ? patented silicon shear stress strain gauge design ? ratiometric to supply voltage ? easy to use chip carrier package options ? 60 mv span (typ) ? differential and gauge options application examples ? air movement control ? environmental control systems ? level indicators ? leak detection ? medical instrumentation ? industrial controls ? pneumatic control systems ? robotics figure 1 shows a schematic of the internal circuitry on the standalone pressure sensor chip. voltage output versus applied differential pressure the differential voltage output of the xducer is directly proportional to the differential pressure applied. the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). xducer is a trademark of motorola, inc. replaces mpx50/d order this document by mpx53/d
semiconductor technical data ? motorola, inc. 2000 basic chip carrier element case 34415, style 1 gauge port option case 344b01, style 1
0 to 50 kpa (0 7.25 psi) 60 mv full scale span (typical) note: pin 1 is the notched pin. pin number 1 2 gnd +v out 3 4 v s v out small outline package mpxv53gc6u case 482a01 mpxv53gc7u case 482c03 pin number 1 2 3 gnd +v out v s 5 6 7 n/c n/c n/c 4v out 8 n/c figure 1. uncompensated pressure sensor schematic xducer + v out v out + v s gnd rev 1
2 motorola sensor device data maximum ratings rating symbol value unit overpressure (8) (p1 > p2) p max 200 kpa burst pressure (8) (p1 > p2) p burst 500 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c operating characteristics (v s = 3.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range (1) p op 0 e 50 kpa supply voltage (2) v s e 3.0 6.0 vdc supply current i o e 6.0 e madc full scale span (3) v fss 45 60 90 mv offset (4) v off 0 20 35 mv sensitivity d v/ d p e 1.2 e mv/kpa linearity (5) e 0.6 e 0.4 %v fss pressure hysteresis (5) (0 to 50 kpa) e e 0.1 e %v fss temperature hysteresis (5) ( 40 c to +125 c) e e 0.5 e %v fss temperature coefficient of full scale span (5) tcv fss 0.22 e 0.16 %v fss / c temperature coefficient of offset (5) tcv off e 15 e m v/ c temperature coefficient of resistance (5) tcr 0.31 e 0.37 %z in / c input impedance z in 355 e 505 w output impedance z out 750 e 1875 w response time (6) (10% to 90%) t r e 1.0 e ms warmup e e 20 e ms offset stability (9) e e 0.5 e %v fss mechanical characteristics characteristic symbol min typ max unit weight (basic element case 34415) e e 2.0 e grams common mode line pressure (7) e e e 690 kpa notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may i nduce additional error due to device selfheating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? tcr: z in deviation with minimum rated pressure applied, over the temperature range of 40 c to +125 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. common mode pressures beyond specified may result in leakage at the casetolead interface. 8. exposure beyond these limits may cause permanent damage or degradation to the device. 9. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.
3 motorola sensor device data temperature compensation figure 2 shows the typical output characteristics of the mpx53 series over temperature. the xducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. this de- vice uses a unique transverse voltage diffused semiconduc- tor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differ- ences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. however, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the mpx2053 series sensors. several approaches to external temperature compensa- tion over both 40 to +125 c and 0 to + 80 c ranges are presented in motorola applications note an840. linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range (see figure 3). there are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. while a least squares fit gives the abest caseo linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the aworst caseo error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. output versus pressure differential figure 3. linearity specification comparison figure 4. crosssectional diagram (not to scale) silicone die coat wire bond lead frame die stainless steel metal cover epoxy case rtv die bond p1 p2 100 012 345 678 10 20 30 40 50 psi kpa 0 output (mv dc ) pressure differential offset (typ) offset (v off ) 70 output (mvdc) 60 50 40 30 20 10 0 0 max p op span (v fss ) pressure (kpa) actual theoretical linearity 90 80 70 60 50 40 30 20 10 0 span range (typ) 40 c + 125 c +25 c mpx53 v s = 3 vdc p1 > p2 figure 4 illustrates the differential or gauge configuration in the basic chip carrier (case 34415). a silicone gel iso- lates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sil- icon diaphragm. the mpx53 series pressure sensor operating characteris- tics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long term reliability. contact the factory for information re- garding media compatibility in your application.
4 motorola sensor device data pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the motorola mpx pressure sensor is designed to operate with positive differen- tial pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpx53d 34415 stainless steel cap MPX53Gp 344b01 side with port attached ordering information mpx53 series pressure sensors are available in differential and gauge configurations. devices are available with basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. mpx series device type options case type order number device marking basic element differential case 34415 mpx53d mpx53d ported elements gauge case 344b01 MPX53Gp MPX53Gp ordering information e small outline package small outline package is currently available as a prototype status device. please contact factory for more information or mechanical samples. device case no. packing options marking mpxv53gc6u 482a01 rails mpxv53g mpxv53gc7u 482c03 rails mpxv53g
5 motorola sensor device data package dimensions case 34415 issue z style 1: pin 1. ground 2. + output 3. + supply 4. output m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane t c m j b a dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30 nom 30 nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 3. dimension a is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). dambar trim zone: f this is included within dim. afo 8 pl 1 23 4 y z y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 case 344b01 issue b style 1: pin 1. ground 2. + output 3. + supply 4. output seating plane b n r c j t d f u h l port #1 positive pressure pin 1 a q s k g 4 pl p s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 notes: 1. dimensioning and tolerancing per ansi y14.5, 1982. 2. controlling dimension: inch. dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 (p1)
6 motorola sensor device data small outline package dimensions case 482a01 issue a dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t a b c m j k pin 1 identifier h seating plane t n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 case 482c03 issue b dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.66 0.034 0.026 0.864 g 0.100 bsc 2.54 bsc j 0.009 0.011 0.23 0.28 k 0.100 0.120 2.54 3.05 m 0 15 0 15 n 0.444 0.448 11.28 11.38 s 0.540 0.560 13.72 14.22 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. 6. dimension s to center of lead when formed parallel. pin 1 k seating plane t s g 4 5 8 1 a b c n v w m j v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 identifier d 8 pl s b m 0.25 (0.010) a s t detail x detail x
7 motorola sensor device data notes
8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applicati ons and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products a re not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications int ended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where perso nal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall ind emnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damag es, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motor ola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. mfax is a trademark of motorola, inc. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiazabu. minatoku, tokyo 1 068573 japan. 81334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 customer focus center: 18005216274 mfax ? : rmfax0@email.sps.mot.com touchtone 1 6022446609 motorola fax back system us & c anada only 18007741848 http://sps.motorola.com/mfax/ home page : http://motorola.com/sps/ mpx53/d ?
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